Ọkachamara smart emeputa nke thermal conductive ihe

Ahụmịhe nrụpụta afọ 10+

Gịnị bụ mgbanwe nke kpọmkwem okpomọkụ ike nke akụkụ abụọ thermal mado pad mgbe ịka nká?

The kpọmkwem okpomọkụ ike nke ihe onwunwe nke ukwuu, maka thermal silica gel mpempe akwụkwọ, thermal na-agbanwe agbanwe ihe onwunwe, abụọ mmiri mmiri thermal gel gasket na-adịkarị nwale obere, na ọ bụghị otú ahụ ugboro ugboro.N'adịghị ka thermal conductivity, thermal resistance, hardness, breakdown voltaji na ihe ndị a na-emekarị ugboro ugboro, ọ bụla ogbe ga-anwale.Taa, anyị dị nnọọ chọrọ ikwu banyere kpọmkwem okpomọkụ ikike ule data nke abụọ-ụlọ ọrụ thermal gel gasket, nke mere na-anwale na CTI, na data bụ n'ezie na a pụrụ ịdabere na ya, ka ịkọrọ gị ihe mgbanwe na kpọmkwem. ike okpomọkụ nke akụkụ abụọ thermal tapawa padafter aging.Nnwale akụkọ ọnụọgụ bụ A218021754030106E

独立站新闻缩略图-68

1, ule akụrụngwa: ngwa ngwa mgbanwe okpomọkụ ụlọ ule, elu na ala okpomọkụ alternating iru mmiri na okpomọkụ ule ụlọ, mgbe niile okpomọkụ na iru mmiri ule ụlọ, iche scanning elu calorimetric mkparịta ụka.
2, ọnọdụ gburugburu ebe obibi: okpomọkụ 22.5 ℃, iru mmiri 48% RH.
3. Nnwale ọkọlọtọ :GB/T 19466.4-2016
4, ọnọdụ ule: ọnọdụ ịka nká

Ọnọdụ 1: Nnwale okpomọkụ iru mmiri na-adịgide adịgide: okpomọkụ 85,85% RH ule oge 600/900/1500h;
Ọnọdụ 2: Nnwale mgbanwe okpomọkụ ngwa ngwa: obere okpomọkụ: -40 ℃, obere okpomọkụ na-ejide oge: 1h, elu okpomọkụ 130 ℃, elu okpomọkụ ijide oge: 1h, okpomọkụ mgbanwe ọnụego: 5'℃ / min, ule okirikiri 192/288 / okirikiri 383;
Ọnọdụ 3: Mmetụta dị elu na nke dị ala: Mgbe elu okpomọkụ ịka nká maka 1200h, obere okpomọkụ ịka nká maka 1200h, elu okpomọkụ 130 ℃, ule oge: 600/900/1200h;Obere okpomọkụ -40 ℃, ule oge: 600/900 / 1200h;


Oge nzipu: Eprel-22-2024